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Over a decade of experience, with a production capacity of one million cubic meters
Offering one-stop delivery from proofing to mass production
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About Cheerise

A technology-based high-tech enterprise and specialized new enterprise focusing on automotive electronics, communication, and data center business

Cheerise Group was founded in 2009, with its headquarters located in Yingtan City, Jiangxi Province. It has two manufacturing factories, Cheerise Circuits Co.,Ltd. and Jiangxi Cheerise Technology Co., Ltd.and Jiangxi Chengrui Technology Co., Ltd., with a total investment of 2 billion yuan.

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注册资金
Total investment
20RMB100mn
公司总人数
Floor area
10ten thousand+㎡
公司总人数
Annual output
180ten thousand+㎡
公司总人数
Registered capital
5350ten thousand
公司总人数
Employees
700+
服务客户数
Customers
600+

Product Center

High precision multi-layer board (PCB)
High precision multi-layer board (PCB)
Multi layer structured precision circuit board, with strong stability and controllable impedance, suitable for industrial control, automotive electronic control, medical equipment, home appliance control and other scenarios, supporting large-scale stable production, full process quality traceability, and short lead time delivery.
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High density interconnect board (HDI)
High density interconnect board (HDI)
Mastering the core processes of blind buried holes and stacked micro through holes, with high wiring density, compact size, and low signal loss, covering first to high-order HDI products, suitable for smartphones, car radar, computing acceleration cards, and portable medical devices.
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Flexible Circuit Board (FPC)
Flexible Circuit Board (FPC)
Using flexible substrates to create bendable lightweight circuits that are compatible with folding and rotating structures, widely used in folding terminals, car display cables, wearable medical devices, and home appliance touch modules. They are lightweight, durable, and have strong structural adaptability.
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High end chip carrier board (SLP)
High end chip carrier board (SLP)
Layout the high-end chip carrier board (SLP) production line for Yingtan Phase III, plan to achieve mass production by 2029, supplement high-end packaging supporting capabilities, and improve one-stop service capabilities for the entire PCB industry chain, targeting high-end packaging scenarios such as computing chips and automotive chips.
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News

Cheerise Connects the World · Precision Manufacturing for the Future

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Automotive Electronics

Communications & Data Centers

Industrial Control

Smart Consumer Electronics

Medical Devices


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Contact Information

Consultation hotline: Mr. Jiang 13146134996/0701-6603999

E-mail mkt00@crpcb.cn

Company Address:Cheerise Circuits Technology Park, Qizhi Street, Hi-tech Industrial Development Zone, Yingtan City, Jiangxi Province, China

Copyright © 2026 Cheerise Circuits Co.,Ltd.

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