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Manufacturing Capability

PROCESS CAPABILITY

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PCB 技术能力参数表
ProjectTechnical Capability
Maximum plate thickness3.2
Minimum plate thickness0.3
Minimum inner layer thickness0.075
Maximum copper thickness5OZ
Minimum copper thickness1/3OZ
Highest layer22L
Minimum machined hole0.15
Drill diameter tolerance+/-0.05
Hole position tolerance+/-0.05
Plate thickness/aperture ratio14：1
Line width/spacing (inner layer)0.065/0.065
Line width/spacing (outer layer)0.065/0.065
Line width tolerance+/-0.010
Minimum solder pad (inner layer)Drill+0.18
Minimum solder pad (outer layer)Drill+0.15
ProjectTechnical Capability
Minimum insulation welding ringDrill+0.20
Interlayer offset0.05
Graphics/solder mask accuracy+/-0.025
Impedance control accuracy+/-8%
Machining dimensions730*622
Product Dimensions690*600
Inter hole distance0.25
Board warping0.5%
Laser drilling plate
Minimum laser aperture0.10
Maximum laser depth0.10
Minimum laser depth0.06
Layer structure2+N+2
Laser drilling pad diameteraperture+0.25
Laser drilling bottom pad diameteraperture+0.25

➢ Surface treatment: OSP, immersion gold, immersion tin, hot air leveling, immersion silver

DELIVERY CAPABILITY

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PCB 生产周期表
Project Double-sided board Four layer board Six layer board Eight layer board Ten layer board More than ten
Quick-turn PCB 2 days 3 days 4 days 5 days 8 days 10 days
sample 3 days 5 days 6 days 8 days 10 days 12 days
batch 8 days 10 days 11 days 12 days 15 days 18 days

Note: For orders containing special materials, the lead time is to be negotiated separately.

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Consultation hotline: Mr. Jiang 13146134996/0701-6603999

E-mail mkt00@crpcb.cn

Company Address:Cheerise Circuits Technology Park, Qizhi Street, Hi-tech Industrial Development Zone, Yingtan City, Jiangxi Province, China

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