Printed circuit board (PCB) is the "skeleton and nerve" of all electronic devices. With the continuous iteration of AI computing power, new energy vehicles, and portable medical equipment towards miniaturization, high speed, and high density, the market demand for high-precision multi-layer PCBs, HDI high-density interconnect boards, and flexible circuit boards continues to rise. As a high-tech enterprise with the ability to mass produce high-end printed circuit boards across all categories in China, Chengrui Circuit provides industry education on the characteristics, application scenarios, and manufacturing difficulties of three mainstream high-end PCB technologies.
1、 High precision multi-layer PCB: industrial, computing power, automotive electronic basic carrier
Multi layer PCBs are stacked and laminated with multiple conductive lines, relying on through holes to achieve interlayer signal interconnection. High precision versions can achieve 8-20 layers, with line width and spacing accuracy controlled to the micrometer level. They have advantages such as good heat dissipation, stable signals, and high power current carrying capacity.
Core applications: AI server motherboard, new energy vehicle electronic control board, industrial frequency converter, large-scale medical testing equipment.
Manufacturing difficulties: multi-layer lamination alignment accuracy, thick copper conductive process, high and low temperature cycling reliability; Chengrui Circuit's dual base is equipped with fully automatic pressing and LDI laser direct writing equipment, with full process quality traceability and stable yield for large orders.
2、 HDI high-density interconnect board: small intelligent terminal core board
HDI is different from traditional multilayer boards in that its core technology is laser micro blind buried hole and stacked hole processes, which do not require large-sized mechanical vias. The wiring density is increased by 2-3 times, greatly reducing the size of the circuit board and reducing signal transmission losses. It is divided into first-order, second-order, and high-order HDI.
Core applications: smartphone motherboard, car radar, portable medical equipment, AI computing power acceleration card.
Industry trend: Currently, advanced HDI is widely used in AI terminals and intelligent automotive sensors, leading to a shortage of market production capacity; Chengrui Circuit Yingtan Phase III Special Plan HDI Intelligent Production Line is expected to be put into operation in 2028, significantly enhancing the supply capacity of advanced HDI.
3、 Flexible Circuit Board (FPC): Flexible and Lightweight Electronic Carrier
Flexible circuit boards are based on polyimide flexible substrates, which can be repeatedly bent, lightweight, and compact. They can adapt to equipment folding and rotating structures, widely solving the structural design problems that traditional hard boards cannot adapt to.
Core applications: Folding screen phones, car display screen cables, wearable medical devices, home appliance touch modules.
As one of the few local manufacturers to achieve stable mass production of three types of high-end PCBs at the same time, Chengrui Circuit relies on a two billion yuan industrial investment and a mature process system to provide customers with one-stop matching of multi-layer boards HDI、 Customized production demand for flexible boards, serving over 300 end customers, with products exported to top electronic brands overseas. In the future, with the implementation of the third phase carrier board and SMT production line, enterprises will integrate the full chain service of "circuit board manufacturing+SMT+packaging substrate" to meet customers' diversified precision circuit needs in one stop.
